Rayton Solar has developed a technique to cleave off 3-um-thick wafers rather than sawing off 200-um-thick wafers. They claim to be able to make 100X as many solar wafers per boule of silicon when compared with traditional techniques:
The idea, while very different, seems comparable to what Evergreen Solar tried to do years ago with their string ribbon technology. These approaches which try to eliminate a lot of the waste often struggle to compete on a cost basis. Hopefully this new idea has some legs.