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Rayton Solar making 3-um-thick silicon wafers

Tue Sep 20, 2016 5:18 pm

Rayton Solar has developed a technique to cleave off 3-um-thick wafers rather than sawing off 200-um-thick wafers. They claim to be able to make 100X as many solar wafers per boule of silicon when compared with traditional techniques:

The idea, while very different, seems comparable to what Evergreen Solar tried to do years ago with their string ribbon technology. These approaches which try to eliminate a lot of the waste often struggle to compete on a cost basis. Hopefully this new idea has some legs.
2011 Leaf SL Demo vehicle
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